印制电路用超厚电解铜箔 Heavy ED Copper Foil for Printed Circuit Board

       公司可提供4OZ—14OZ(名义厚度140 µ m-500 µ m)的甚低轮廓度高温延展性超厚电解铜箔(VLP-THE-HF),产品为片状,最大规格1295mm*1295mm.甚低轮廓高温延展性超厚电解铜箔不但具胡等轴细晶、低轮廓、高强度、高延伸率的优良物理性能,同时具有高剥离强度、无铜粉转移、圆形清晰的PCB制造性能,适用于电力、汽车等大功率电路用“大电流PCB”的制造。

      We provide the 4oz/ft2 to 14oz/ft2(nominal thickness 140 µm to 500µ m)very-low-profile,high temperature elongation,and heavy (VLP-THE-HF)ED copper foils,they are sheet products; and the max dimension is 1295╳1295mm.They have the perfect physical characteristics of the fine and uniform crystal structure ,the low profile,the high intensity,and high elongation;and they also have the PCB manufacturing performances of the high peel strength,no copper powder movement,the clear figure.They can be used in production of the extreme PCBs which are used in the extremer circuits of the electric power and the motor vehicles.


超厚电解铜箔特性


  注:1、剥离强度为标准FR-4板测试值。(140℃/5张7628PP)

      2、品质保证期限自收货日起90天。

Note:1、The peel strength is the test value of the standard FR-4 plate.( 140℃ 5 pieces of the 7628PP)

        2、The duration of the quality guarantee period is 90 days from the receiving date.


印制电路用电解铜箔 ED Copper Foil for Printed Circuit Board

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