印制电路用电解铜箔 ED Copper Foil for Printed Circuit Board

        公司可提供1/3OZ-3OZ(名义厚度12um-105um)的低轮廓(L)高温延展性(HTE)铜箔特性,产品幅宽250mm-1340mm,产品质量达到IPC4562-2000标准II、III级要求,具有优异的常温储存性能、高温抗氧化性能、优良的高温延伸性能,适用于各类树脂体系的双面、多层印制线路板。公司亦可提供低轮廓(LP)、甚低轮廓(VLP)的高温延展性电解铜箔(HTE)。

    We provide the 1/3oz/ft2 to 3oz/ ft2 (nominal thickness 12 µ m to 105 µ m ) high temperature elongation (THE) ED copper foils,the widths are from 250-1340 mm,and the quality reaches the II and III requirements of the international standard IPC-4562,these products have the perfect normal temperature storage performance,the high temperature anti-oxidization performance,and high temperature elongation performance,and can be used in the production of the different double-face and multi-layer printed boards.We can also provide low-profile(LV)and very low-profile (VIP) THE ED copper foils.


低轮廓(L)高温延展性(HTE)铜箔特性



注:1、铜箔毛面RZ值为HR测试稳定值,不作保证值。

        2、剥离强度为标准FR-4板测试值。(140℃/5张7628PP)

        3、品质保证期限自收货日起90天。

Note: 1、The Rz value of the surface roughness is the tested stable value,not the guarantee value.

         2、The peel strength is the test value of the standard FR-4 plate.( 140℃ 5 pieces of the 7628PP)

         3、The duration of the quality guarantee period is 90 days from the receiving date.

高抗拉双光锂电铜箔 High tensile double-shiny Li-ion ED copper foil

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印制电路用超厚电解铜箔 Heavy ED Copper Foil for Printed Circuit Board
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