挠性覆铜板用LP-S-B/R铜箔 Matte side treatment low profile foil in back/red
公司可提供1/3OZ—1OZ(名义厚度12 µ m-35 µ m)的LP-S-B/R铜箔特性，产品幅宽：520（±1）mm，可依据客户要求裁切成各种尺寸（最大1300mm），铜箔表面为黑色或红色；较低的表面粗度，适合于挠性覆铜板；较高的致密度，具有较高的耐弯曲性；特别适用于精细电路；良好的蚀刻性。应用于：挠性覆铜板；精细电路的FPC; LED用覆晶薄膜。
We can provide the 1/3oz/ft2 to 1oz/ft2(nominal thickness 12 µm to 35µ m),standard width：520(±1)mm,may according to the customer request tailor(max 1300mm),the treated foil in back or red ,low profile with properties of LP-S-B/R suitable for FCCL; grain structure of copper foil leads to high flesibility; low profile enables to make fine circuit pattern; excelient etching performance.Application:casting and lamination type FCCL; super fine pattern; chip on flex(CDF)for LED.
注：我们测试抗剥离强度所使用的是PI，铜箔在客户PI上的抗剥离强度请重新确认。
Note:We test the peel strength with PI,please recanfitm with your PI and adhersives.
